// Setup the GAP Bond Manager
{
uint32 passkey = 0; // passkey
"000000"
uint8 pairMode = GAPBOND_PAIRING_MODE_WAIT_FOR_REQ;
uint8
mitm = TRUE;
uint8 ioCap = GAPBOND_IO_CAP_DISPLAY_ONLY;
uint8
bonding = TRUE;
GAPBondMgr_SetParameter( GAPBOND_DEFAULT_PASSCODE, sizeof
( uint32 ), &passkey );
GAPBondMgr_SetParameter(
GAPBOND_PAIRING_MODE, sizeof ( uint8 ), &pairMode );
GAPBondMgr_SetParameter( GAPBOND_MITM_PROTECTION, sizeof ( uint8 ), &mitm
);
GAPBondMgr_SetParameter( GAPBOND_IO_CAPABILITIES, sizeof ( uint8 ),
&ioCap );
GAPBondMgr_SetParameter( GAPBOND_BONDING_ENABLED, sizeof (
uint8 ), &bonding );
}
TI BLE ： GAP Bond Manager,布布扣,bubuko.com
原文：http://www.cnblogs.com/wwjdwy/p/3631411.html